
Intel and 3D Glass Solutions will build a roughly $3.3 billion glass-core substrate manufacturing plant in Odisha, India. The agreement covers an advanced-packaging glass-core substrate facility in the Bhubaneswar-Khurda region, planned over five to six years. Substrates serve as the engineered base that connects silicon to the circuit board by routing power and signals. As transistor scaling slows, performance gains increasingly come from packaging. Glass-core substrates use tighter, faster interconnections than organic materials, supporting dense designs. The facility targets about 70,000 glass substrates per year, around 50 million assembled units, and close to 13,000 advanced 3D heterogeneous-integration modules. The project is expected to create more than 1,800 direct high-skilled jobs, with additional indirect employment. Funding is supported through the India Semiconductor Mission with central and state backing.
"Intel and 3D Glass Solutions have signed an agreement to build a roughly $3.3 billion substrate-manufacturing plant in the eastern state of Odisha, the government announced on Friday."
"Substrates are the unglamorous layer that makes modern chips work. They are the engineered base a processor is mounted on, routing power and signals between the silicon and the circuit board, and as chipmakers hit the limits of shrinking transistors, the packaging around the silicon has become where much of the performance gain now lives."
"Glass-core substrates, the technology at the centre of this plant, are seen as a leap over today's organic materials, offering tighter, faster interconnections for the densest designs. The plant's output targets reflect that ambition."
"According to the government, it is expected to produce around 70,000 glass substrates a year, some 50 million assembled units, and close to 13,000 advanced 3D heterogeneous-integration modules, the stacked, multi-die packages that pack several chips into one. It is also expected to create more than 1,800 direct high-skilled jobs, with wider indirect employment around it."
#semiconductors #advanced-packaging #glass-core-substrates #india-semiconductor-mission #manufacturing
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