"The star of the show was the industry's first mass-produced liquid cooling system combined with advanced air-cooling innovations. You can learn more about it on the company's official site. This is liquid cooling similar to what you see in powerful gaming PCs and AI servers - a pump circulates liquid over hotspots in the machine and then towards a fan and radiator that expel the heat. Just to be clear - we've seen vapor chambers sometimes be referred to as "liquid cooling". While they do have liquid in them, they are passive cooling devices. This is an active cooling system that can handle a lot more heat."
"This system needed to fit in a smartphone, so REDMAGIC went to great lengths to miniaturize the components. It built a piezoelectric ceramic micropump, which is the heart of the system. It took thousands of design iterations to reach the final design as the pump had to strike the right balance between fluid circulations and fitting inside a slim package. The company used micron-level laser cutting to carve channels that carry the liquid between the pump and the fan. Channel membranes were designed for smooth, low-resistance flow. The liquid being pumped is an anti-freezing coolant (based on a fluorinated liquid), which remains effective between -40°C and 70°C (-40°F and 158°F)."
"There were other difficulties along the way - you are pretty unlikely to drop your gaming PC, but dropping your phone isn't all that rare. To that end, REDMAGIC used an ultra-low-temperature bonding process and new anti-puncture membranes to ensure that the phone can survive a hit - to survive tens of thousands of drop tests, actually. Which phone is that? The upcoming REDMAGIC 11 Pro s"
REDMAGIC introduced a mass-produced active liquid cooling system for smartphones that combines liquid circulation with advanced air-cooling. A piezoelectric ceramic micropump moves an anti-freezing fluorinated coolant across hotspots toward a fan and radiator. Micron-level laser cutting forms low-resistance channels and specially designed membranes to optimize flow. The coolant functions from −40°C to 70°C and offers electrical insulation and strong heat transfer. Ultra-low-temperature bonding and anti-puncture membranes provide drop durability, surviving tens of thousands of tests. Thousands of design iterations miniaturized the system to fit inside the slim REDMAGIC 11 Pro s smartphone chassis.
Read at GSMArena.com
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