"Broadcom has indicated that TSMC's production capacity is now visibly under pressure, a significant change from the perception of virtually unlimited capacity just a few years ago."
"The demand for AI infrastructure is the primary driver of the current strain on the semiconductor supply chain, with TSMC's advanced production lines operating at full capacity."
"Bottlenecks are emerging not only in chip production but also in related sectors, such as the limited availability of optical components and the capacity limits of printed circuit board suppliers."
"The shift toward multi-year contracts among customers highlights the growing importance of securing production capacity in a market heavily dependent on reliable supply."
The global semiconductor supply chain is under pressure from sustained demand for AI chips, with TSMC's production capacity visibly strained. Major clients like Nvidia and Apple exacerbate this issue. Although TSMC plans expansions through 2027, current constraints are expected to impact the supply chain by 2026. Bottlenecks are also occurring in related sectors, such as optical components and printed circuit boards, leading to longer delivery times. Companies are increasingly signing multi-year contracts to secure production capacity, reflecting the need for supply security.
Read at Techzine Global
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