""Even more so than the silicon itself, chip packaging is going to transform how this AI revolution comes to fruition over the next decade.""
""Packaging now ranks as 'the more interesting part of the Foundry business today' and can hit 40% gross margins - matching the company's core product business.""
Advanced packaging has become essential in the AI sector, enabling the combination of chiplets, high-bandwidth memory, and interconnects. This process enhances performance, power efficiency, and cost management as AI models scale. Intel is leveraging this demand to boost its foundry business, with advanced packaging tools like EMIB and Foveros providing denser connections and lower costs. The company is in talks with major hyperscalers like Google and Amazon for packaging services, indicating potential for substantial revenue growth and high profit margins.
Read at 24/7 Wall St.
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