SK Hynix projects the high-bandwidth memory (HBM) market to expand roughly 30% annually through 2030, with strong AI end-user demand underpinning growth. Major cloud providers increasing AI capital spending are expected to boost HBM purchases. HBM stacks DRAM chips vertically to save space and reduce power, addressing AI dataset processing needs. The custom HBM segment is expected to reach tens of billions of dollars by decade's end. SK Hynix is developing HBM4 with a customer-specific base die for deeper customization and reduced direct substitutability. Large customers receive tailored HBM while smaller customers use standard designs, and supply dynamics could pressure near-term pricing.
very firm and strong,
The relationship between AI build-outs and HBM purchases is very straightforward,
each customer has different taste,
We are confident to provide, to make the right competitive product to the customers.
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