#ushio-300

#ushio-300

The Bravia 3 II mid-range LED TV features the XR processor, granting access to Sony's proprietary Clear Image algorithm, auto HDR tone mapping, and more.

SB Energy will build a 10-gigawatt (GW) server farm and 10 GW of new generation capacity, with at least 9.2 GW being gas-fired, to support both the local grid and the datacenter.

A severe shortage of NAND flash, driven by the enormous demand for it to expand AI data centers, makes procurement impossible. Sony is currently unable to fulfill orders for CFexpress Type A, CFexpress Type B, and SDXC/SDHC memory cards.

SK Hynix's order for nearly $8 billion in EUV machines from ASML is the largest publicly announced single order in the company's history, aimed at enhancing advanced memory chip production.

Meta is building these chips because buying AI hardware at scale is expensive, and relying too heavily on external suppliers leaves less room to shape that hardware to its own needs. Building more in-house could help the company keep AI costs in check.

Lace Lithography uses a beam of helium atoms rather than light to etch chip patterns, achieving a width of approximately 0.1 nanometres, which is about 135 times finer than ASML's EUV light.

The need for higher performance and more energy-efficient chips is driving high growth rates for leading-edge logic, high-bandwidth memory and advanced packaging. These are areas where Applied is the process equipment leader, and we expect to grow our semiconductor equipment business over 20 percent this calendar year.

Here we addressed this challenge by incorporating an intrinsically stretchable exciplex-assisted phosphorescent (ExciPh) layer. The elastomer-tolerant triplet-recycling mechanism mitigates exciton energy transfer limitations arising from the insulating elastomer matrix, yielding a light-emitting layer with more than 200% stretchability and an external quantum efficiency (EQE) of 21.7%. To translate this performance to fully stretchable devices, we integrated MXene-contact stretchable electrodes (MCSEs), which feature high mechanical robustness and tunable work function (W

We look, not just for the next five years, we look at the next 10, maybe 15 years. The focus is on advanced packaging and a possible expansion of the chip size that ASML's machines can handle, positioning the company to capitalize on the rapidly evolving AI chip manufacturing landscape.

Samsung Electronics has secured temporary certificates of occupancy (TCOs) for a portion of its semiconductor facility in Taylor. This should allow the facility to start operations ahead of full completion later this year. City officials confirmed that approximately 88,000 square feet of Samsung's Fab 1 building has received temporary approval, with additional areas expected to follow. The overall timeline for permitting the remaining sections has not yet been finalized.