U.S. Plans Up to $1.6 Billion in Funding for Packaging Computer Chips
Briefly

The proposed $1.6 billion funding under the CHIPS Act aims to enhance technology for chip packaging, crucial for applications like artificial intelligence and high-performance computing.
The focus will be on faster data transfer between chips and heat management. U.S. seeks to reduce reliance on foreign factories, particularly in chip packaging processes.
Read at www.nytimes.com
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