The trading record provides proof that the Tensor G5 will be fabbed by TSMC instead of Samsung, expected to power the Pixel 10 series in late 2025.
The integration of 16GB RAM in the Pixel 9 series marks a significant advancement tied to the chipset; TSMC's InFO_PoP technology allows for thinner packaging and improved electrical and thermal properties.
The upcoming Tensor G4 chipset promises improved heat management and power efficiency compared to the G3, but its performance might not directly indicate how the G5 will perform due to a major redesign in the G5.
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