Los Alamos lab to research next-gen chip technologies
Briefly

Los Alamos National Laboratory (LANL) is spearheading a project aimed at revolutionizing semi-conductor chip design and manufacturing to enhance energy efficiency and resilience against environmental extremes like radiation. The initiative combines LANL's Nano Solutions On-Chip project with others under the newly established Microelectronics Science Research Center (CHIME). CHIME will leverage nanoscale semiconductors, integrating electronic and photonic components into three-dimensional architectures to overcome current challenges linked to bandwidth density and circuit reliability in harsh environments. This innovation holds promise to improve data transmission efficiency and mitigate the vulnerabilities of standard semiconductor technologies.
Los Alamos National Laboratory is leading a transformative project in chip design and manufacturing, aiming for more energy-efficient solutions that withstand extreme environmental conditions.
The Microelectronics Science Research Center (CHIME) will integrate innovative nanoscale semiconductors and 3D structures, addressing issues of efficiency and radiation tolerance in electronics.
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