The Mate 70 Pro/Pro+ is set to incorporate a familiar front design featuring three punch holes, maintaining a similar aesthetic to its predecessor, the Mate 60 Pro and Pro+, while also possibly improving its internal architecture.
Leaked images indicate that the Mate 70 Pro/Pro+ will have a flat frame design, differing from the rounded edges seen in earlier models, suggesting a potential shift in the device's overall design philosophy.
The upcoming series is anticipated to house the Kirin 9100 chipset, reportedly produced on SMIC's advanced N+3 process node, hinting at enhancements in processing power and efficiency compared to past models.
The familiar camera layout seen in previous iterations will likely continue with the Mate 70 series, reassuring fans of the Mate line in both functionality and aesthetic continuity.
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