The Huawei Mate 90 series will feature a 3nm-like Kirin chip

Huawei announced a next-generation Kirin chipset for the Mate 90 lineup, built on the LogicFolding architecture. The chip is described as the company’s first mobile chip using LogicFolding and is positioned to compete with 3nm-class chips. Huawei did not explicitly claim a 3nm process, instead stating the chip will be on the same level as modern 3nm chips. LogicFolding is credited with increasing transistor density by 53.5%, improving performance by 41%, and raising peak frequency by 12.7%. The architecture is also expected to enhance energy efficiency. The chipset name remains undisclosed and details are expected closer to the Mate 90 series launch in the fall.

"The chip in question is said to be the first mobile chip for the company built on the LogicFolding architecture, and will be able to compete with 3nm chips. Interestingly, the spokesperson didn't exactly say that the next Kirin chip will be 3nm, but instead said it will be on the same level as modern 3nm chips."

"The innovative architecture allowed the company to increase the transistor density by 53.5%, which improves performance by 41% and increases the peak frequency by 12.7%. This will also improve energy efficiency."

"Shortly after Huawei brought to light its new scaling law called Tao Scaling Law and its LogicFolding architecture, the company held a keynote at the Phoenix Bay Area Finance Forum and Financial Summit in Shenzhen, promising to bring a much more powerful, next-generation Kirin chipset that will power the upcoming Mate 90 lineup."

"However, the name of the next-generation Kirin chipset remains undisclosed and we will likely get the tidbits once the Huawei Mate 90 series launch is near, which will be this fall."

Read at GSMArena.com