The Huawei Mate 90 series will feature a 3nm-like Kirin chip
A next-generation Huawei Kirin mobile chip using LogicFolding architecture is promised for the Mate 90 lineup, targeting performance and efficiency comparable to modern 3nm chips.
Huawei to produce 1.4nm chips by 2031, comes up with a new scaling law for semiconductors
Huawei proposes Tau (τ) Scaling Law and LogicFolding architecture to overcome chip manufacturing limits and replace Moore’s Law with time-based scaling.