Former Intel CEO Pat Gelsinger criticized TSMC's plans for US fabrication plants, arguing that without substantial R&D in the US, America cannot achieve semiconductor leadership. He emphasized that TSMC's R&D remains in Taiwan, meaning the advanced technologies used in US factories will not originate domestically. Gelsinger's vision involved investing over $100 billion in new fabs and building a competitive foundry business, but his strategy yielded significant losses, indicating challenges in making Intel a formidable player against TSMC.
If you don't have R&D in the US, you will not have semiconductor leadership in the US.
All of the R&D work of TSMC is in Taiwan, and they haven't made any announcements to move that.
Chips fabricated in the US will primarily use technologies from abroad, undermining America's leadership in semiconductor technology.
Intel's grand plan included spending over $100 billion on new fabs, but it hasn't produced immediate positive results.
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