ST Micro, in partnership with Amazon Web Services, introduced a cutting-edge photonic integrated circuit (PIC100) that will enable pluggable optics functioning at speeds up to 1.6 Tbps. Designed to meet the escalating bandwidth demands of AI cluster architectures, this chip is set to enhance data transmission with 200 Gbps per lane capability and efficient heat management through advanced waveguides and fiber couplers. Production aims to commence later this year, with further developments targeting 400 Gbps lanes for even higher aggregate speeds in optical interconnects.
At launch, the fab says the chips will be capable of carrying 200 Gbps of bandwidth per lane - that's twice what existing pluggable optics can do today.
According to ST, the PIC100 will be fabricated using its BiCMOS process technology and is designed to efficiently convert electrical signals to optical ones and back again.
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