Lace Lithography uses a beam of helium atoms rather than light to etch chip patterns, achieving a width of approximately 0.1 nanometres, which is about 135 times finer than ASML's EUV light.
Our custom accelerator business is progressing very well across five customers. Anthropic will soon implement one gigawatt of Broadcom-baked TPUs, and we expect the AI company plans a three-gigawatt deployment in 2027. Meta will install multiple gigawatts of Broadcom's XPU accelerators in 2027 and beyond. OpenAI will deploy over one gigawatt of compute capacity based on custom XPUs in 2027.
The gold rush across the high-end processor market might help Apple's processor manufacturing partner, TSMC, drive harder bargains than in the past. That's because Apple's huge appetite for processors is being met by fast-growing demand for chips for servers. As a result, the cost of the chips used inside Macs, iPads, and iPhones will likely increase, putting even more inflationary pressure on Cupertino's bottom line.
Sorano will be available with up to 84 Zen 5 cores - up from 64 on Siena - in a power envelope of just 225 watts. AMD isn't ready to spill all the beans on its latest Epyc just yet, but based on core count alone, we surmise the chip will either feature six density-optimized Zen 5c chiplets with 14 of 16 cores enabled or 12 of the frequency-optimized Zen 5 variety with one of the eight cores fused off.
The idea of machines that can build even better machines sounds like sci-fi, but the concept is becoming a reality as companies like Cadence tap into generative AI to design and validate next-gen processors that also use AI. In the early days of integrated circuits, chips were designed by hand. In the more than half a century since then, semiconductors have grown so complex and their physical features so small that it's only possible to design chips using other chips.
